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產(chǎn)品介紹IMBM-Q170A搭載了第6代Intel® Core™處理器以及Intel® Q170芯片組，支持最多64 GB內(nèi)存。主板擁有包括PCIe 3.0/2.0插槽和COM端口在內(nèi)的各類I/O以及擴(kuò)展接口。同時(shí)該款主板還具有0 ~ 60°C的工作溫度范圍，能夠?yàn)槿魏晤愋偷墓I(yè)或嵌入式計(jì)算應(yīng)用提供最為全面的支持。
功能特點(diǎn)6th/7th Generation Intel® Core™ LGA1151 Processor DDR4 DRAM Support, 2133 MHz, Max. 64GB Three Independent Display: HDMI x 2, DVI-I Port x 1 Dual Intel® Gigabit Ethernet, LAN1 Supports iAMT 11.0 USB 3.0 Port x 10, USB 2.0 Port x 4 TPM Optional (Via Pin Header)
技術(shù)規(guī)格 [IMBM-Q170A]| SYSTEM | | PROCESSOR | 7th/6th Generation Intel® Core™ i7/i5/i3/Pentium®/ Celeron® 14nm LGA1151 Socket Processor | | CHIPSET | Intel® Q170 Express Chipset | | MEMORY | 288-pin DIMM x 4, max. 64GB, DDR4 2133/1867 MHz, non-ECC, un-buffered memory, Dual channel memory architecture | | I/O CHIPSET | NCT6791D, F81216HD | | ETHERNET | LAN 1: Intel® PHY i219LM Giga LAN (supports iAMT 11.0) x 1
LAN 2: Intel® i211AT Giga LAN x 1, RJ-45 x 2 | | AUDIO | Realtek® ALC887 (Colay with ALC886) | | TPM | 20-1 PIN header for TPM1.2/FW3.19 | | EXPANSION SLOT | PCIe 3.0/2.0[x16] Slot x 1, PCIe 3.0/2.0[x4] Slot (open edge) x 1, PCIe 3.0/2.0[x1] Slot (open edge) x 1, PCI x 1 | | BIOS | 128M bit Flash ROM x 1, AMI BIOS | | H/W MONITOR | Temperature Monitor on CPU/Chassis, Voltage Monitor on Vcore/5V/3.3V/12V, Fan Monitor on CPU/Chassis | | WATCHDOG TIMER | 1~255 steps by software program | | SMART FAN CONTROL | CPU Fan/ Chassis Fan x 2 | | WAKE ON LAN/ PXE | Yes (WOL/PXE) | | POWER STATE | S3, S4, S5 | | GRAPHICS |
| GRAPHICS CHIPSET | Intel® HD Graphics | | GRAPHICS MULTI DISPLAY | DVI-I+HDMI, HDMI+HDMI | | VGA | Up to 1920 x 1200 @60Hz | | DVI | Up to 1920 x 1200 @60Hz | | HDMI | HDMI 1.4 up to 4096 x 2304 @30Hz | | DISPLAYPORT | — | | LVDS | — | | EDP | — | | BACKLIGHT CONTROL | — | | ENVIRONMENTAL & POWER & ME | | BATTERY | Lithium battery | | POWER REQUIREMENT | 24-pin ATX connector x 1, 8-pin ATX 12V Power connector x 1 | | OPERATING TEMPERATURE | 32°F ~ 140°F (0°C ~ 60°C) | | STORAGE TEMPERATURE | -40°F ~ 185°F (-40°C ~ 85°C) | | OPERATING HUMIDITY | 0% ~ 90% RH, non-condensing | | CERTIFICATION | CE & FCC Class A | | FORM FACTOR | Micro-ATX Form Factor, 9.6” x 9.6” (244mm x 244mm) | | WEIGHT | 1.76 lb (0.8 Kg) | | MTBF (HOURS) | 193,470 |
| REAR PANEL I/O PORTS | | USB | USB 3.0 port x 10 | | DISPLAY I/O | DVI-I x 1, HDMI x 2 | | AUDIO I/O | Audio Jack x 3: Line-in, Mic-in, Line-out | | LAN I/O | LAN (RJ-45) port x 2 | | SERIAL PORT | RS-232/422/485 DB-9 connector x 1 (COM1, supports 5/12V on RI pin) | | PS/2 PORT | PS/2 Combo Port (Keyboard & Mouse) x 1 | | OTHERS | — | | INTERNAL I/O CONNECTORS | | STORAGE | SATA3 (6.0Gb/s) port x 6, supports RAID 0/1/5/10 | | USB | USB 2.0 connector x 2 supports additional USB port x 4 | | DISPLAY I/O | — | | AUDIO I/O | Speaker header x 1 (Line-out) | | SERIAL PORT | RS-232 header x 5 | | PS/2 PORT | — | | PARALLEL PORT | — | | DIO | 8-bit Digital I/O interface x 1 (In/Out programmable) | | FAN | CPU Fan connector(s) (4-pin) x 1, Chassis Fan connector(s) (4-pin) x 2 | | OTHERS | Front panel header x 1, Clear CMOS jumper x 1, TPM header x 1, BIOS flash header (2[x4]P p=1.27mm) x 1, Chassis Intrusion x 1 |
| OS | | OS SUPPORT | Windows® 7 32/64-bit
Windows® 8.1 64-bit
Windows® 10 64-bit
Linux Fedora 64bit |
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